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DOI: The Impacts Of Some Assembling Factors On The Properties Of Chipboard
Prof. T.Y. Ofuokwu, Prof. Abdullahi Mohammed , Department Of Engineering, Ahmadu Bello University, NigeriaAbstract
The impacts of sort of wood outfit molecule board, explicit gravity and press shutting speed
on properties of resultant chipboard were examined. Tests were done as per the
arrangements of ASTM D 1037 - 78 and property estimations contrasted and least qualities
set by Business Standard - CS 236 - 66. Property estimations explored were Modulus OJ Break
(MOB) and Modulus Of Versatility (M.O.V.) in bowing just as the Inside Bond (IB). Information
were broke down utilizing factorial examination and relapse investigation with Sham Factors.
Most factors or potentially their cooperation were found to have altogether (at 0.01 level)
influenced properties.
Keywords
Assembling Factors,, Modulus of Break
References
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Food And Farming Association of the Assembled Countries. Fiber and Chipboard. Report
of a Universal Conference on Protection Board, Hardboard and Chipboard. F.A.O., Rome
pp, 1998.
Cultivate, W.G. Species Variety. In Continuing of the Principal Discussion on Chipboard.
Washington State College, Pullman, Washington 1987, pp. 210- 220.
Liiri, O. also, Muhammad S. Urea formaldehyde Chipboard.Tropical Backwoods Science
Vol (3), 1998, pp 326 - 334.
Kehr, E. (1989). Impact of Explicit gravity and Sap Content on Properties of Chipboard. Vol
(14), 1979, pp 431 - 434
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