Phani Suresh Paladugu. “Hybrid 2.5D 3D Integration of Photonic Chiplets and Compute Dies for Scalable Co-Packaged Optical Interconnects in AI Data Centers”. The American Journal of Engineering and Technology 8, no. 03 (March 4, 2026): 1–19. Accessed March 9, 2026. https://theamericanjournals.com/index.php/tajet/article/view/7531.