PROF. T.Y. OFUOKWU, PROF. ABDULLAHI MOHAMMED. The Impacts Of Some Assembling Factors On The Properties Of Chipboard. The American Journal of Engineering and Technology, [S. l.], v. 2, n. 06, p. 11–14, 2022. DOI: 10.37547/tajet/Volume02Issue06-03. Disponível em: https://theamericanjournals.com/index.php/tajet/article/view/3024. Acesso em: 2 aug. 2025.